book

Millimeter Wave Wireless Communications

by Theodore S. Rappaport, Robert W. Heath, Robert C. Daniels, James N. Murdock

September 2014

Intermediate to advanced

704 pages

23h 56m

English

Pearson

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1.1 The Frontier: Millimeter Wave Wireless1.2 A Preview of MmWave Implementation Challenges1.3 Emerging Applications of MmWave Communications1.3.1 Data Centers1.3.2 Replacing Wired Interconnects on Chips1.3.3 Information Showers1.3.4 The Home and Office of the Future1.3.5 Vehicular Applications1.3.6 Cellular and Personal Mobile Communications1.3.7 Aerospace Applications1.4 Contributions of This Textbook1.5 Outline of This Textbook1.5.1 Illustrations for this Textbook1.6 Symbols and Common Definitions1.7 Chapter Summary
2.1 Introduction2.2 Complex Baseband Representation2.3 Digital Modulation2.3.1 Symbols2.3.2 Symbol Detection2.3.3 Binary Phase Shift Keying and Variants2.3.4 Amplitude Shift Keying and Variants2.3.5 Quadrature Phase Shift Keying and Variants2.3.6 Phase Shift Keying2.3.7 Quadrature Amplitude Modulation2.4 Equalization in the Time Domain2.4.1 Linear Equalization2.4.2 Decision Feedback Equalization2.4.3 Maximum Likelihood Sequence Estimation2.5 Equalization in the Frequency Domain2.5.1 Single Carrier Frequency Domain Equalization2.5.2 OFDM Modulation2.6 Error Control Coding2.6.1 Block Codes for Error Detection2.6.2 Reed-Solomon Code2.6.3 Low Density Parity Check Codes2.6.4 Convolutional Codes2.6.5 Trellis Coded Modulation2.6.6 Time Domain Spreading2.6.7 Unequal Error Protection2.7 Estimation and Synchronization2.7.1 Structure to Facilitate Communication2.7.2 Frequency Offset Synchronization2.7.3 Frame Synchronization2.7.4 Channel Estimation2.8 Multiple Input Multiple Output (MIMO) Communication2.8.1 Spatial Multiplexing2.8.2 Spatial Diversity2.8.3 Beamforming in MIMO Systems2.8.4 Hybrid Precoding2.9 Hardware Architectures2.10 System Architecture2.11 Chapter Summary
3.1 Introduction3.2 Large-Scale Propagation Channel Effects3.2.1 Log-Distance Path Loss Models3.2.2 Atmospheric Effects3.2.3 Weather Effects on MmWave Propagation3.2.4 Diffraction3.2.5 Reflection and Penetration3.2.6 Scattering and Radar Cross Section Modeling3.2.7 Influence of Surrounding Objects, Humans, and Foliage3.2.8 Ray Tracing and Site-Specific Propagation Prediction3.3 Small-Scale Channel Effects3.3.1 Delay Spread Characteristics3.3.2 Doppler Effects3.4 Spatial Characterization of Multipath and Beam Combining3.4.1 Beam-Combining Procedure3.4.2 Beam-Combining Results3.5 Angle Spread and Multipath Angle of Arrival3.6 Antenna Polarization3.7 Outdoor Channel Models3.7.1 3GPP-Style Outdoor Propagation Models3.7.2 Vehicle-to-Vehicle Models3.8 Indoor Channel Models3.8.1 Ray-Tracing Models for Indoor Channels3.8.2 Rayleigh, Rician, and Multiwave Fading Models3.8.3 IEEE 802.15.3c and IEEE 802.11ad Channel Models3.8.4 IEEE 802.15.3c3.8.5 IEEE 802.11ad3.9 Chapter Summary
4.1 Introduction4.2 Fundamentals of On-Chip and In-Package MmWave Antennas4.2.1 Antenna Fundamentals4.2.2 Fundamentals of Antenna Arrays4.3 The On-Chip Antenna Environment4.3.1 Complementary Metal Oxide Semiconductor Technology (CMOS)4.4 In-Package Antennas4.5 Antenna Topologies for MmWave Communications4.6 Techniques to Improve Gain of On-Chip Antennas4.6.1 Integrated Lens Antennas4.7 Adaptive Antenna Arrays — Implementations for MmWave Communications4.7.1 Beam Steering for MmWave Adaptive Antenna Arrays4.7.2 Antenna Array Beamforming Algorithms4.7.3 Specific Beamforming Algorithms — ESPRIT and MUSIC4.7.4 Case Studies of Adaptive Arrays for MmWave Communications4.8 Characterization of On-Chip Antenna Performance4.8.1 Case Studies of MmWave On-Chip Antenna Characterization4.8.2 Improving Probe Station Characterizations of On-Chip or In-Package Antennas4.9 Chapter Summary
5.1 Introduction5.2 Basic Concepts for MmWave Transistors and Devices5.3 S-Parameters, Z-Parameters, Y-Parameters, and ABCD-Parameters5.4 Simulation, Layout, and CMOS Production of MmWave Circuits5.5 Transistors and Transistor Models5.6 More Advanced Models for MmWave Transistors5.6.1 BSIM Model5.6.2 MmWave Transistor Model Evolution — EKV Model5.7 Introduction to Transmission Lines and Passives5.7.1 Transmission Lines5.7.2 Differential versus Single-Ended Transmission Lines5.7.3 Inductors5.7.4 Parasitic Inductances from Bond Wire Packaging5.7.5 Transformers5.7.6 Interconnects5.8 Basic Transistor Configurations5.8.1 Conjugate Matching5.8.2 Miller Capacitance5.8.3 Poles and Feedback5.8.4 Frequency Tuning
5.10 Important Metrics for Analog MmWave Devices5.10.1 Non-Linear Intercept Points5.10.2 Noise Figure and Noise Factor5.11 Analog MmWave Components5.11.1 Power Amplifiers5.11.2 Low Noise Amplifiers5.11.3 Mixers5.11.4 Voltage-Controlled Oscillators (VCOs)5.11.5 Phase-Locked Loops5.12 Consumption Factor Theory5.12.1 Numerical Example of Power-Efficiency Factor5.12.2 Consumption Factor Definition5.13 Chapter Summary
6.1 Introduction6.2 Review of Sampling and Conversion for ADCs and DACs6.3 Device Mismatches: An Inhibitor to ADCs and DACs6.4 Basic Analog-to-Digital Conversion Circuitry: Comparators6.4.1 Basic ADC Components: Track-and-Hold Amplifiers6.5 Goals and Challenges in ADC Design6.5.1 Integral and Differential Non-Linearity6.6 Encoders6.7 Trends and Architectures for MmWave Wireless ADCs6.7.1 Pipeline ADC6.7.2 Successive Approximation ADCs6.7.3 Time-Interleaved ADC6.7.4 Flash and Folding-Flash ADC6.7.5 ADC Case Studies6.8 Digital-to-Analog Converters (DACs)6.8.1 Basic Digital-to-Analog Converter Circuitry: The Current DAC6.8.2 Case Studies of DAC Circuit Designs6.9 Chapter Summary
7.1 Introduction7.2 Practical Transceivers7.2.1 Signal Clipping and Quantization7.2.2 Power Amplifier Non-linearity7.2.3 Phase Noise7.3 High-Throughput PHYs7.3.1 Modulation, Coding, and Equalization7.3.2 A Practical Comparison of OFDM and SC-FDE7.3.3 Synchronization and Channel Estimation7.4 PHYs for Low Complexity, High Efficiency7.4.1 Frequency Shift Keying (FSK)7.4.2 On-Off, Amplitude Shift Keying (OOK, ASK)7.4.3 Continuous Phase Modulation7.5 Future PHY Considerations7.5.1 Ultra-Low ADC Resolution7.5.2 Spatial Multiplexing7.6 Chapter Summary
8.1 Introduction8.2 Challenges when Networking MmWave Devices8.2.1 Directional Antennas at the PHY8.2.2 Device Discovery8.2.3 Collision Detection and Collision Avoidance8.2.4 Channel Reliability Due to Human Blockage8.2.5 Channel Utilization and Spatial Reuse8.3 Beam Adaptation Protocols8.3.1 Beam Adaptation in IEEE 802.15.3c8.3.2 Beam Adaptation in IEEE 802.11ad8.3.3 Beam Adaptation for Backhaul8.3.4 Beam Adaptation through Channel Estimation8.4 Relaying for Coverage Extension8.5 Support for Multimedia Transmission8.6 Multiband Considerations8.7 Performance of Cellular Networks8.8 Chapter Summary
9.1 Introduction9.2 60 GHz Spectrum Regulation9.2.1 International Recommendations9.2.2 Regulations in North America9.2.3 Regulations in Europe9.2.4 Regulations in Japan9.2.5 Regulations in Korea9.2.6 Regulations in Australia9.2.7 Regulations in China9.2.8 Comments9.3 IEEE 802.15.3c9.3.1 IEEE 802.15.3 MAC9.3.2 IEEE 802.15.3c MmWave PHY9.4 WirelessHD9.4.1 Application Focus9.4.2 WirelessHD Technical Specification9.4.3 The Next Generation of WirelessHD9.5 ECMA-3879.5.1 Device Classes in ECMA-3879.5.2 Channelization in ECMA-3879.5.3 MAC and PHY Overview for ECMA-3879.5.4 Type A PHY in ECMA-3879.5.5 Type B PHY in ECMA-3879.5.6 Type C PHY in ECMA-3879.5.7 The Second Edition of ECMA-3879.6 IEEE 802.11ad9.6.1 IEEE 802.11 Background9.6.2 Important IEEE 802.11ad MAC Features9.6.3 Directional Multi-Gigabit PHY Overview for IEEE 802.11ad9.7 WiGig9.8 Chapter Summary

Content preview from Millimeter Wave Wireless Communications

Chapter 4. Antennas and Arrays for MmWave Applications

4.1 Introduction

The extremely short wavelengths of mmWave signals (e.g., 10.7 mm at 28 GHz, 5 mm at 60 GHz, and 789 μm at 380 GHz) offer enormous potential for mmWave antenna arrays that are adaptive, high gain, and inexpensive to fabricate and integrate in mass-produced consumer electronic products. There are both cost and performance advantages that result from extremely integrated and physically small antennas. From a cost perspective, mmWave antennas may be directly integrated with other portions of a transceiver and may be fabricated with either packaging or integrated circuit (IC) production technology. This is a stark departure from all existing wireless systems to date, which rely ...