Microassembly and micropackaging of implantable systems
M. Schuettler and T. Stieglitz, University of Freiburg, Germany
Abstract:
The successful realization of an implantable sensor system for medical applications requires an overview on how individual electronic, electromechanical or mechanical components can be assembled and later packaged in order to allow a long failure-free operation inside the patient. This chapter provides insights into common microassembly methods and electronic packaging methods including hermetic packaging and non-hermetic polymeric encapsulation. The latter particularly requires the implant component technology and assembly methods to be selected very thoroughly in order to reliably protect the electronics ...
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