Manufacturing Engineering and Technology, 8th in SI Units by Pearson

Chapter 28

Fabrication of Microelectronic Devices

28.1 Introduction

28.2 Clean Rooms

28.3 Semiconductors and Silicon

28.4 Crystal Growing and Wafer Preparation

28.5 Film Deposition

28.6 Oxidation

28.7 Lithography

28.8 Etching

28.9 Diffusion and Ion Implantation

28.10 Metallization and Testing

28.11 Wire Bonding and Packaging

28.12 Yield and Reliability

28.13 Printed Circuit Boards

28.14 Roll-to-Roll Printing of Flexible Electronics

28.15 Flexible Hybrid Electronics

Examples:

28.1 Moore’s Law

28.2 Comparison of Wet and Dry Etching

28.3 Processing of a p-type Region in n-type Silicon

Case Study:

28.1 A Flexible Arduino

 

• This chapter presents the science and the technologies involved in the production of integrated circuits, a product that has ...