October 2010
Intermediate to advanced
416 pages
10h 31m
English
book
Power Integrity for I/O Interfaces: With Signal Integrity/Power Integrity Co-Design
by Vishram S. Pandit, Woong Hwan Ryu, Myoung Joon Choi
Content preview from Power Integrity for I/O Interfaces: With Signal Integrity/Power Integrity Co-Design
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Chapter 4. System Interconnects
This chapter gives an overview of the Power Distribution Networks (PDN) and signal distribution networks for the digital electronic systems. The basic building blocks of the system are Printed Circuit Board (PCB), package, and on-chip networks. The PCB and package PDN have power/ground planes and various PDN capacitors. The on-chip PDN is composed of the power/ground grid and on-chip capacitors. This chapter describes different components of PDN and signal networks. The effects of different types of capacitors on self-impedance of the PDN are analyzed; signal routing schemes such as microstrip lines, striplines, and coupled lines are described in detail; analytical expressions for these routing schemes are provided; ...
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