Integrated Circuit Design for Radiation Environments

Acknowledgments

The authors are thankful for the years of experience and support from companies such as Radiation Inc., Harris Corporation, RCA, Intersil, and IBM, that were early pioneers in the production of radiation‐hardened integrated circuits.

The authors are also thankful for the institutions that support and promote the radiation effects community by publishing journals, hosting conferences, and promoting learning through lecture series, invited talks, and tutorials. Conferences and symposia hosted by the IEEE, including the Nuclear Space and Radiation Effects Conference (NSREC), International Reliability Physics Symposium (IRPS), and the International Physical and Failure Analysis (IPFA) Symposium, as well as the EOS/ESD Association's Electrical Overstress/Electrostatic Discharge (EOS/ESD) Symposium provided both inspiration and motivation for the development of this text.

The authors acknowledge the gift of radiation effects knowledge provided by the many researchers and scientists that came before us as well as those that are our colleagues. We hope that we properly cited and recognized your works.

And finally, the authors would like to thank the publisher and staff of John Wiley and Sons Ltd. for their support for this text.

Stephen J. Gaul

Nicolaas van Vonno

Steven H. Voldman

Wesley H. Morris