November 2016
Intermediate to advanced
212 pages
6h 54m
English
Takeshi Hattori, Hattori Consulting International, Chigasaki, Japan
With semiconductor device geometry shrinking and becoming more complex, highly diluted chemicals are used during aqueous silicon-wafer cleaning. The use of physical cleaning aids such as megasonic agitation with dilute chemistry or high-pressure atomizing jet sprays to avoid reduction of particle-removal efficiency is prone to cause structural damage to high-aspect-ratio large-scale integrated (LSI) circuit structures with low mechanical strength as well as fragile freestanding microelectromechanical system (MEMS) structures. The surface tension of water used in wafer rinsing after ...
Read now
Unlock full access