Chapter 1

Nonaqueous Cleaning Challenges for Preventing Damage to Fragile Nanostructures

Takeshi Hattori,    Hattori Consulting International, Chigasaki, Japan

Abstract

With semiconductor device geometry shrinking and becoming more complex, highly diluted chemicals are used during aqueous silicon-wafer cleaning. The use of physical cleaning aids such as megasonic agitation with dilute chemistry or high-pressure atomizing jet sprays to avoid reduction of particle-removal efficiency is prone to cause structural damage to high-aspect-ratio large-scale integrated (LSI) circuit structures with low mechanical strength as well as fragile freestanding microelectromechanical system (MEMS) structures. The surface tension of water used in wafer rinsing after ...

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