October 2003
Beginner to intermediate
256 pages
5h 15m
English
Pure silicon is grown from single crystals into long cylinders 6 -12 inches in diameter. Diamond saws then slice the cylinders into very thin wafers.
A process of masking, etching, and diffusing steps creates hundreds of identical ICs on each wafer. Precise ovens process batches of wafers at over 1,000 degrees centigrade.
Figure B.1 shows a simplified overview of the basic manufacturing process steps, which are listed below.
1. | Grow a pure crystalline silicon ingot |
2. | Saw the ingot into wafers with a diamond saw |
3. | Polish wafer and flatten one edge of the wafer for alignment |
4. | Grow a protective layer of silicon dioxide (quartz glass) on the wafers |
5. | Spin on a very thin film of light sensitive photoresist (resist) |
6. | Expose ... |
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