book

Signal Integrity and Radiated Emission of High-Speed Digital Systems

by Spartaco Caniggia, Francescaromana Maradei

December 2008

Intermediate to advanced

552 pages

17h 44m

English

Wiley

Read now

Unlock full access

1.1 Power and Signal Integrity1.2 Radiation Emission1.3 Signaling and Logic Devices1.4 Modeling Digital Systems
2.1 Input/Output Static Characteristic2.2 Dynamic Characteristics: Gate Delay and Rise and Fall Times2.3 Driver and Receiver Modeling2.4 I/O Buffer Information Specification (IBIS) ModelsReferences
3.1 Loop Inductance3.2 Partial Inductance3.3 Differential Mode and Common Mode InductanceReferences

4.1 Capacitance Between Conductors4.2 Differential Mode and Common Mode CapacitanceReferences
5.1 Electrical Parameters of Interconnects5.2 Incident and Reflected Waves in Lossless Transmission Lines5.3 Signal Distribution Architecture5.4 Line TerminationsReferences
6.1 Lumped-Circuit Model of Coupled Lines6.2 Common and Differential Modes6.3 Models for Digital Devices: Simulation and Measurements6.4 General Distributed Model for Lossless Multiconductor Transmission Lines6.5 Techniques to Reduce CrosstalkReferences
7.1 Lossy Line Fundamental Parameters7.2 Modeling Lossy Lines in the Time Domain by the Segmentation Approach and Vector Fitting Technique7.3 Modeling Lossy Lines in the Time Domain by the Scattering Parameters Technique7.4 ConclusionsReferences
8.1 Switching Noise8.2 Filtering Power Distribution8.3 Ground Bounce8.4 Crosstalk and Switching NoiseReferences
9.1 Frequency Characterization of a Digital Signal9.2 The Radiated Emission Problem9.3 Emission from Traces9.4 Emission from ICs9.5 Emission from a Real PCB9.6 Emission from a PCB with an Attached Cable9.7 Differential Drivers as Sources of Emission9.8 Emission from a Complex System9.9 Radiation Diagrams9.10 Points to Remember and Design Rules for Radiated EmissionReferences
10.1 Common-Mode Coupling10.2 Ground and Power Distribution in a Multilayer PCB10.3 Grounding at PCB Connectors10.4 Partitioning and Modeling10.5 Points to Remember and Design Rules for Grounding in PCBsReferences
11.1 Time-Domain Reflectometer (TDR)11.2 Vector Network Analyzer (VNA)11.3 Prediction Model Validation by Radiated Emission MeasurementsReferences
12.1 Differential Signal Transmission12.2 Modeling Packages and Interconnect Discontinuities in PCBsReferences
A.1 Round WiresA.2 BusbarsA.3 Examples of Application of the Inductance FormulaeReferences
B.1 MicrostripB.2 StriplineB.3 Trace Attenuation and the Proximity-Effect ParameterReferences
C.1 Cavity ModelC.2 Spice ModelC.3 Numerical ModelC.4 Results of the SimulationsReferences
D.1 Wire StructuresD.2 Wires and Ground PlanesD.3 Emission from AperturesReferences
E.1 Nodal Method EquationsE.2 Nodal Method Applied to Compute the Partial Inductance Associated with a Finite Ground PlaneReferences
F.1 Program Files of Chapter 1F.2 Program Files of Chapter 2F.3 Program Files of Chapter 5F.4 Program Files of Chapter 6F.5 Program Files of Chapter 7F.6 Program Files of Chapter 8F.7 Program Files of Chapter 9F.8 Program Files of Chapter 10

Content preview from Signal Integrity and Radiated Emission of High-Speed Digital Systems

images

Become an O’Reilly member and get unlimited access to this title plus top books and audiobooks from O’Reilly and nearly 200 top publishers, thousands of courses curated by job role, 150+ live events each month,
and much more.

Start your free trial

Transmission Lines in Digital and Analog Electronic Systems: Signal Integrity and Crosstalk

CLAYTON R. PAUL

High-Speed Devices and Circuits with THz Applications

Jung Han Choi

Microwave and Millimeter Wave Circuits and Systems: Emerging Design, Technologies and Applications, 2nd Edition

Apostolos Georgiadis, Hendrik Rogier, Luca Roselli, Paolo Arcioni

Modeling of Digital Communication Systems Using SIMULINK

Allen H. Levesque, Arthur A. Giordano

Publisher Resources

ISBN: 9780470511664Purchase book