Signal Integrity and Radiated Emission of High-Speed Digital Systems

Index

A

Absorbing Boundary Condition (ABC), 32

Advanced Telecommunications Computing Architecture (ATCA), 441, 445–446, 459–465

Analog ground, 365

Antenna,

dipole, 11, 284–287, 290–291, 305, 336–341, 351, 374, 436

folded dipole, 290–292

long-dipole, 269, 278, 340, 342, 348

short/small/Hertzian/infinitesimal dipole, 269, 277–278, 280, 296, 300, 501–503

wire, 278–279, 305, 501–504

aperture,

low-frequency model of an, 336–338, 500–505

polarizability of an, 336, 504–505

attenuation, 166–168, 175–179, 194, 214, 487–492

microstrip, 488–489

stripline, 490

Advanced BiCMOS technology (ABT), 40, 49, 123

Advanced Schottky FAST TTL, 39

Advanced CMOS (FACT), 42, 47, 49,

Antipad, 372, 404, 471

Application Specific Integrated Circuit (ASIC), 237

B

Backplane, 29, 380–382, 445–448, 459–465

Ball Grid Array (BGA), 445, 476

Bandwidth (BW) of a digital clock, 274

Bend, 441, 466–467

Bessel function, 168–169

Board

A-Test, 294–295, 313–314

D-test, 320–327

P-Test, 285–287, 307–311, 338–341

S-Test, 289, 292–294, 311–313

SBC-test, 247–254, 296–298, 314–318

SQ-test, 299–203, 262–266, 299–302

Bond wire, 221

Bounce,

Ground, 2, 219, 225–226, 235–237, 254–266, 350

Power, 5, 8, 219, 226, 235–237, 254–266, 350, 515

Bridge, 355, 773–774, 393–394, 399–402, 404, 449

Buried capacitor (BC), 219, 239, 243, 247–249, 254, 297, 316, 350–351

Bulk capacitor, 221, 223, 236

Busbar, 73–74, 221, 224, 227–228, 230, 235–236, 256, 288, 315, 481–485

Bused LVDS (BLVDS), 448

Bypass capacitor, 29, 50, 231, 370, 375,

C

Cable

Coaxial, ...