Signal Integrity and Radiated Emission of High-Speed Digital Systems

List of Examples

Example 3.1: Calculation of Inductances Associated with the Decoupling Capacitor and IC Device in a PCB

Example 5.1: Measurements and Graphical Method Applied to an Interconnection with TTL Devices

Example 6.1: Point-to-Point Structure

Example 6.2: Chain Structure

Example 6.3: Two Coupled Lines with Linear Loads

Example 6.4: Two Coupled Traces with TTL Devices in a Point-to-Point Test Board Structure

Example 6.5: Two Coupled Lines in a Bus Test Board Structure

Example 6.6: Five Coupled Lines with Non-linear Loads

Example 7.1: Trace with 50 Ω Characteristic Impedance

Example 7.2: Signal Integrity in a Lossy Coaxial Cable

Example 7.3: Signal Integrity in a Lossy UTP Cable

Example 7.4: Eye Diagram of a 75m Unshielded Twisted-pair Cable Driven by an RS422 Device

Example 7.5: Coaxial Cable Driven by an Ultrawide-band Signal Simulated by the TL Model Based on the Time-domain S-parameters

Example 8.1: Switching Noise Simulations of Two Stripline and Microstrip Structures

Example 8.2: Test Board for Prediction of Power Bus Impedance by Several Methods

Example 8.3: Measurements and Simulations with Standard Buried Capacitance (SBC) Test Boards

Example 9.1: Computations and Measurements of a Clock Spectrum

Example 9.2: Calculations and Measurements of Emission Produced by P-Test Boards

Example 9.3: Calculations and Measurements of Emission from S-Test Boards

Example 9.4: Calculations and Measurements of Emission from A-Test Boards

Example 9.5: Calculations and Measurements ...