November 2004
Beginner
368 pages
19h 44m
English
Content preview from The Circuit Designer's Companion, 2nd Edition
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General product design 321
9.5.3 Power semiconductor mounting
The way in which a power device package is mounted to its heatsink affects both actual
heat transfer efficiency and long-term reliability. Faulty mounting of metal packaged
devices mainly causes unnecessarily high junction temperature, shortening device
lifetime. Plastic packages (such as the common TO-220 outline) are much more
susceptible to mechanical damage, which allows moisture into the case and can even
crack the semiconductor die.
The factors which you should consider when deciding on a mounting method are
summarised in Figure 9.15 for a typical plastic-packaged device.
Heatsink surface ...
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