book

Thermal Design, 2nd Edition

Name: Thermal Design, 2nd Edition
Author: HoSung Lee
ISBN: 9781119685975

by HoSung Lee

June 2022

Intermediate to advanced

928 pages

29h 26m

English

Wiley

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Cover
Title Page
Copyright
Dedication
Preface to the Second Edition
Preface to the First Edition
About the Companion Website
1 Introduction
1.1 INTRODUCTION1.2 HUMANS AND ENERGY1.3 THERMODYNAMICS1.4 HEAT TRANSFERPROBLEMSREFERENCES
2 Heat Sinks
2.1 LONGITUDINAL FIN OF RECTANGULAR PROFILE2.2 HEAT TRANSFER FROM FIN2.3 FIN EFFECTIVENESS2.4 FIN EFFICIENCY2.5 CORRECTED PROFILE LENGTH2.6 OPTIMIZATIONS2.7 PLATE FIN HEAT SINKS2.8 MULTIPLE FIN ARRAY II2.9 THERMAL RESISTANCE AND OVERALL SURFACE EFFICIENCY2.10 FIN DESIGN WITH THERMAL RADIATIONPROBLEMSCOMPUTER ASSIGNMENTSPROJECTREFERENCES
3 Heat Pipes
3.1 OPERATION OF HEAT PIPE3.2 SURFACE TENSION3.3 HEAT TRANSFER LIMITATIONS3.4 HEAT PIPE THERMAL RESISTANCE3.5 VARIABLE CONDUCTANCE HEAT PIPES (VCHP)3.6 LOOP HEAT PIPES3.7 MICRO HEAT PIPES3.8 WORKING FLUID3.9 WICK STRUCTURES3.10 DESIGN EXAMPLEPROBLEMSDESIGN PROBLEMREFERENCES

4 Compact Heat Exchangers
4.1 INTRODUCTION4.2 FUNDAMENTALS OF HEAT EXCHANGERS4.3 DOUBLE‐PIPE HEAT EXCHANGERS4.4 SHELL‐AND‐TUBE HEAT EXCHANGERS4.5 PLATE HEAT EXCHANGERS (PHE)4.6 PRESSURE DROPS IN COMPACT HEAT EXCHANGERS4.7 FINNED‐TUBE HEAT EXCHANGERS4.8 PLATE‐FIN HEAT EXCHANGERS4.9 LOUVER‐FIN‐TYPE FLAT‐TUBE PLATE‐FIN HEAT EXCHANGERS4.10 PLATE‐FINNED HEAT PIPE HEAT EXCHANGERPROBLEMSREFERENCES
5 Thermoelectric Design
5.1 INTRODUCTION5.2 THERMOELECTRIC GENERATORS5.3 THERMOELECTRIC COOLERS AND HEAT PUMPS5.4 OPTIMAL DESIGN5.5 THOMSON EFFECT, EXACT SOLUTION, AND COMPATIBILITY FACTOR5.6 THERMAL AND ELECTRICAL CONTACT RESISTANCES FOR MICRO AND MACRO DEVICES5.7 MODELING OF THERMOELECTRIC GENERATORS AND COOLERS WITH HEAT SINKS5.8 APPLICATIONSPROBLEMSCOMPUTER ASSIGNMENTPROJECTSCOMPUTER ASSIGNMENTSCOMPUTER PROJECTSREFERENCES
6 Thermoelectric Materials
6.1 CRYSTAL STRUCTURE6.2 PHYSICS OF ELECTRONS6.3 DENSITY OF STATES, FERMI ENERGY, AND ENERGY BANDS6.4 THERMOELECTRIC TRANSPORT PROPERTIES FOR ELECTRONS6.5 PHONONS6.6 LOW‐DIMENSIONAL NANOSTRUCTURES6.7 GENERIC MODEL OF BULK SILICON AND NANOWIRES6.8 THEORETICAL MODEL OF THERMOELECTRIC TRANSPORT PROPERTIESPROBLEMSREFERENCES
7 Solar Cells
7.1 INTRODUCTION7.2 QUANTUM MECHANICS7.3 DENSITY OF STATES7.4 EQUILIBRIUM INTRINSIC CARRIER CONCENTRATION7.5 EXTRINSIC SEMICONDUCTORS IN THERMAL EQUILIBRIUM7.6 GENERATION AND RECOMBINATION7.7 RECOMBINATION7.8 CARRIER TRANSPORT7.9 MINORITY CARRIER TRANSPORT7.10 CHARACTERISTICS OF SOLAR CELLS7.11 ADDITIONAL TOPICS7.12 MODELING7.13 DESIGN OF A SOLAR CELLPROBLEMSREFERENCES
Appendix A Thermophysical Properties
REFERENCES
Appendix B
B.1 OPTIMAL DIMENSIONLESS PARAMETERS FOR TEGS WITH ZT∞2 = 1 (SEE FIGURE B.1 AT THE END OF TABLES)B.2 OPTIMAL DIMENSIONLESS PARAMETERS FOR TECS WITH ZT∞2 = 1 (SEE FIGURE B.2 AT THE END OF TABLES)
Appendix C Pipe Dimensions
Appendix D Periodic Table
Appendix E Thermoelectric Properties
E.1 BISMUTH TELLURIDE P‐TYPEE.2 BISMUTH TELLURIDE N‐TYPEE.3 LEAD TELLURIDE P‐TYPEE.4 SILICON GERMANIUM N‐TYPEE.5 SKUTTERUDITES N‐TYPEE.6 ZINTL COMPOUND N‐TYPEREFERENCES
Appendix F Fermi Integral
Appendix G Hall Factor
REFERENCES
Appendix H Curve Fitting of Working Fluids
H.1 CURVE FIT FOR WORKING FLUIDS CHOSENH.2 CURVE FITTING FOR WORKING FLUID PROPERTIES CHOSEN
Appendix L Tutorial for MathCAD
L.1 TUTORIAL PROBLEM FOR MATHCAD
Appendix M Conversion Factors
Index
End User License Agreement

Content preview from Thermal Design, 2nd Edition

Appendix GHall Factor

A magnetic field H_z in the z‐direction applied perpendicularly to an electric current i_x in the x‐direction will produce an electric field E_y in the y‐direction. Then the Hall coefficient R_H is defined by

(G.1) $upper R Subscript upper H Baseline equals StartFraction upper E Subscript y Baseline Over i Subscript x Baseline upper H Subscript z Baseline EndFraction$

In order to obtain the Hall coefficient, we have to solve the Boltzmann transport equation under the relaxation time approximation with the magnetic field. The exact solution, assuming a parabolic single band, eventually leads to the electrical conductivity, Seebeck coefficient, and electronic thermal conductivity, where the detailed derivation can be found in Putley [1] and Goldsmid [2]. Here just the results are presented. The electrical conductivity is

(G.2) $sigma Subscript x Baseline equals StartFraction e squared Over upper T EndFraction StartFraction upper X 0 squared plus upper Y 0 squared Over upper X 0 EndFraction$

The Seebeck coefficient is

(G.3) $alpha Subscript x Baseline equals StartFraction 1 Over italic e upper T EndFraction left-parenthesis StartFraction upper X 1 upper X 0 plus upper Y 1 upper Y 0 Over upper X 0 squared plus upper Y 0 squared EndFraction minus upper E Subscript upper F Baseline right-parenthesis$

The electronic thermal conductivity is

(G.4) $k Subscript l comma x Baseline equals StartFraction 1 Over upper T squared EndFraction left-parenthesis upper X 2 plus StartFraction upper X 0 upper Y 1 squared minus 2 upper X 1 upper Y 1 upper Y 0 minus upper X 1 squared upper X 0 Over upper X 0 squared plus upper Y 0 squared EndFraction minus upper E Subscript upper F Baseline right-parenthesis$

where

(G.5a) $StartLayout 1st Row 1st Column upper X Subscript s 2nd Column equals minus StartFraction 2 upper T Over 3 m Subscript d Superscript asterisk Baseline EndFraction integral Subscript 0 Superscript infinity Baseline StartFraction upper E Superscript s plus 1 Baseline dot tau dot g Over 1 plus beta squared EndFraction StartFraction partial-differential f 0 Over partial-differential upper E EndFraction italic d upper E EndLayout$

(G.5b) $StartLayout 1st Row 1st Column upper Y Subscript s 2nd Column equals minus StartFraction 2 upper T Over 3 m Subscript d Superscript asterisk Baseline EndFraction integral Subscript 0 Superscript infinity Baseline StartFraction beta dot upper E Superscript s plus 1 Baseline dot tau dot g Over 1 plus beta squared EndFraction StartFraction partial-differential f 0 Over partial-differential upper E EndFraction italic d upper E EndLayout$

(G.5c)

τ is the carrier relaxation time, and g is the carrier density of states. Now we ...

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Thermal Design, 2nd Edition

by HoSung Lee

Appendix GHall Factor

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