book

Semiconductor Packaging

Name: Semiconductor Packaging
ISBN: 9781439862070

by Andrea Chen, Randy Hsiao-Yu Lo

April 2016

Intermediate to advanced

216 pages

5h 35m

English

CRC Press

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Cover
Half Title
Title Page
Copyright Page
Table of Contents
Preface
Authors
Partial list of abbreviations, acronyms, and symbols
Section I: Semiconductor packages
Chapter 1 History and background
1.1 Objectives1.2 Introduction1.3 Brief history1.3.1 Hermetic packaging1.3.2 Plastic packaging1.4 Wire bonding process flow1.5 Flip-chip process flow comparison1.6 Equipment1.7 Material interactionsBibliography

Chapter 2 Package form factors and families
2.1 Objectives2.2 Introduction2.3 Package outline standardization2.4 Leaded package families2.4.1 Dual lead package family2.5 Quad lead package family2.6 Substrate-based package families2.6.1 Ball grid array package family2.7 Chip scale packages2.7.1 Substrate-based chip scale packages2.7.2 Quad flat no lead2.8 Stacked-die package family2.9 Package-on-package and related variations2.10 Flip-chip packages2.11 Wafer-level chip scale packagesBibliography
Chapter 3 Surface-mount technology
3.1 Objectives3.2 Introduction3.3 Background3.4 Package cracking or “popcorning”3.5 Surface-mount packages: peripheral leads versus area array3.6 Issues with advanced packaging3.7 Current and trends3.7.1 Lead-free and halogen free packagingBibliography
Chapter 4 Other packaging needs
4.1 Objectives4.2 Introduction4.3 Tape automated bonding4.4 Micro electro-mechanical4.5 Image sensor modules4.6 Memory cards4.7 Packaging needs for solar technologyBibliography
Section II: Package reliability
Chapter 5 Reliability testing
5.1 Introduction5.2 Background5.3 Examples of reliability tests5.3.1 Preconditioning conditions5.3.1.1 Package failure mode: package crack or popcorning5.3.2 Temperature cycling and thermal shock5.3.2.1 Package failure modes from temperature cycling and thermal shock5.3.2.2 Package failure mode: delamination5.3.3 High-temperature storage life5.3.3.1 Package failure mode: intermetallics5.3.4 Temperature-humidity-bias tests5.3.4.1 Package failure mode: corrosion5.4 Limitations of reliability testingBibliography
Section III: Materials used in semiconductor packaging
Chapter 6 Polymers
6.1 Molding compounds6.1.1 Objectives6.1.2 Introduction6.1.3 Background6.1.4 Newer formulations6.1.4.1 Biphenyl6.1.4.2 Multifunctional6.1.4.3 Aromatic resins6.1.5 Technology challenges6.1.5.1 Moldability6.1.5.2 Glass transition temperature6.1.5.3 Flexural modulus6.1.5.4 Coefficient of thermal expansion6.1.5.5 Stress index6.1.6 Failure modes associated with molding compounds6.1.6.1 Package cracking during solder reflow6.1.6.2 Substrate postmold warpage6.1.7 Future developments6.1.7.1 “Green” molding compounds and changes to retardant additives6.1.7.2 Molded6.1.7.3 High-density packaging6.1.7.4 Compatibility with copper wire bonding6.2 Die attach adhesives6.2.1 Objectives6.2.2 Introduction6.2.3 Background6.2.4 Materials composition6.2.4.1 Liquid epoxy resin6.2.4.2 Silver flakes and other filler materials6.2.4.3 Reactive epoxy diluents and solvents6.2.4.4 Catalysts and hardeners6.2.4.5 Other additives These components are usually proprietary and play an important role in producing a high-performance die attach adhesive.6.2.5 Materials analysis6.2.5.1 Glass transition temperature6.2.5.2 Coefficient of thermal expansion6.2.5.3 Thixotropic index6.2.5.4 Ionic purity6.2.6 Reliability and performance6.2.6.1 Outgassing6.2.6.2 Resin bleed6.2.7 Future developments6.2.7.1 Three-dimensional (3D) packaging6.2.7.2 Lead-free and restriction of hazardous substances (RoHS)6.2.7.3 Compatibility with copper wire bonding6.2.7.4 Other developments6.3 Underfill materials6.3.1 Objectives6.3.2 Introduction6.3.3 What is underfill?6.3.4 The purpose of underfill6.3.5 The (standard) underfill process6.3.6 Underfill properties6.3.6.1 Glass transition temperature6.3.6.2 Coefficient of thermal expansion6.3.7 Alternate underfill processes6.3.7.1 “No flow” underfill6.3.7.2 Reworkable underfill6.3.7.3 Preapplied underfill6.3.7.4 Molded underfill6.3.8 Areas of research and development6.3.8.1 Maintaining capillary flow as features sizes shrink6.3.8.2 Compatibility with lead-free bump process steps, including for copper pillar bumps6.3.9 Failure modes6.4 Organic substrates6.4.1 Objectives6.4.2 Introduction6.4.3 Background6.4.4 Ball grid arrays and chip scale packages6.4.4.1 Microvias and high-density interconnect technology6.4.5 Future developmentsBibliography
Chapter 7 Metals
7.1 Lead frames, heat spreaders, and heat sinks7.1.1 Objectives7.1.2 Introduction7.1.3 Lead frames7.1.4 Metals commonly used in lead frames and other components7.1.4.1 Copper7.1.4.2 Alloy427.1.4.3 Aluminum7.1.5 Heat slugs, heat spreaders, and heat sinks7.1.5.1 Heat slugs or spreaders7.1.5.2 Heat sinks7.1.6 Plating finishes7.2 Bonding wires7.2.1 Objectives7.2.2 Introduction7.2.3 Bonding wires7.2.3.1 Gold7.2.3.2 Copper7.2.3.3 Aluminum7.2.3.4 Other7.2.4 Kirkendall effect7.2.4.1 Gold-aluminum intermetallics and Kirkendall effect7.2.4.2 Kirkendall effect for copper wire bonding on aluminum bond pads7.2.5 Heat-affected zone phenomenon in bonding wire7.2.5.1 How is the heat-affected zone created?7.2.5.2 Effect of heat-affected zone on loop height7.2.6 Other reliability issues7.2.6.1 Copper wire bonding and corrosion7.2.7 Materials analysis7.2.7.1 Visual inspection7.2.7.2 Bond etching7.2.7.3 Bond pull7.2.7.4 Ball shear tests7.2.8 Recent developments7.2.8.1 Copper wire bonding on nickel-palladium electroless plated bond pads7.3 Solders7.3.1 Objectives7.3.2 Introduction7.3.3 Types of solders7.3.3.1 Lead-based7.3.3.2 Lead-free7.3.3.3 Gold-based7.4 Wafer bumping7.4.1 Objectives7.4.2 Introduction7.4.3 Bump metallurgies7.4.3.1 “C4”7.4.3.2 Electroplating7.4.3.3 Electroless (UBM) plating and screen/ stencil printing solder7.4.3.4 Lead-free bumping metallurgies7.4.3.5 Alternative to solder bumping technologies7.4.4 Under-bump metallurgy7.4.4.1 Vacuum deposition7.4.4.2 Electroplating7.4.4.3 Electroless plating7.4.5 Technical issues7.4.6 Future directionsBibliography
Chapter 8 Ceramics and glasses
8.1 Objectives8.2 Introduction8.3 Types of ceramics used in semiconductor packaging8.3.1 Alumina8.3.2 Beryllia8.3.3 Aluminum nitride8.3.4 Silicon carbide8.3.5 Boron nitride8.4 Types of glasses used in semiconductor packaging8.4.1 Silver filled glass8.4.2 Lead alkali borosilicate glassBibliography
Section IV:—The future
Chapter 9 Trends and challenges
9.1 Objectives9.2 Introduction9.3 Copper interconnects and low-к dielectric materials9.3.1 Copper interconnects9.3.2 Dielectric materials9.4 Dielectric constant requirements at each technology node9.5 Future interconnect and dielectric materials9.5.1 Interconnects for <22 nm9.5.2 Dielectric materials for ≥22 nm9.5.3 Dielectric materials for ≥22 nm9.6 Future packaging options9.6.1 Codesigning the chip with the package9.6.2 Three-dimensional (3D) integration9.6.3 Through-silicon viasBibliography
Chapter 10 Light-emitting diodes
10.1 Objectives10.2 Introduction10.3 Unique characteristics of light-emitting diode (LED) packaging needs10.4 Reliability requirements for LED packagesBibliography
Glossary
Bibliography
Appendix A: Analytical tools
A.1 IntroductionA.2 Types of analytical toolsA.3 Nondestructive tools and testsA.3.1 IntroductionA.3.2 Optical/visual inspectionA.3.3 X-ray inspectionA.3.4 Scanning acoustic microscopyBibliography
Appendix B: Destructive tools and tests
B.1 IntroductionB.2 DecapsulationB.3 Dye penetrationB.4 Cross-sectioning and polishingB.5 Scanning electron microscopy (SEM)B.6 Transmission electron microscopy (TEM)B.7 Chemical and elemental testsB.7.1 Auger electron spectroscopy (AES)B.7.2 Energy-dispersive X-ray spectroscopy (EDS or EDX)B.7.3 Fourier transform infrared spectroscopy (FTIR)B.7.4 Secondary ion mass spectrometry (SIMS)B.8 Other analytical techniquesB.8.1 Bonding wire pullB.8.2 Ball bond shearB.8.3 Differential scanning calorimetry (DSC)B.8.4 Flexural testingBibliography
Index

Overview

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.

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