Appendix B: Destructive tools and tests

 

 

 

 

B.1 Introduction

These techniques, on the other hand, essentially alter or destroy the sample, irreversibly. Following are some of the commonly employed methods with respect to semiconductor packaging:

 

Decapsulation techniques

Dye penetration for leak detection

Cross-sectioning and polishing

Scanning electron microscopy (SEM)

Transmission electron microscopy (TEM)

Chemical and elemental testing

Other analytical techniques

 

A few other test methods were discussed in previous chapters. First from Chapter 6, Section 6.1.5 was flexure testing to determine flexural modulus. Next from Chapter 6, Section 6.2.4, is a brief description of differential scanning calorimetry (DSC). Finally from ...

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