5.1 Introduction

Once the chip has been packaged and electrically tested, there is the requirement that the package demonstrate field reliability. Because it is impossible to assess that in real time and on all device/package combinations out in the field, accelerated testing is done on a statistically significant sample size to confirm operational reliability.

Qualification or reliability—accelerated—tests are aimed at the following:


Inducing typical failure modes rapidly

Decreasing the amount of time required to assess the reliability of a given package and device combination

Screening out defects early and quickly

Forecasting what might be the useful lifetime of a given part based on acceleration ...

Get Semiconductor Packaging now with the O’Reilly learning platform.

O’Reilly members experience live online training, plus books, videos, and digital content from nearly 200 publishers.