6.1 Molding compounds
6.1.1 Objectives
• Describe what a molding compound is.
• Convey its purpose and importance in semiconductor packaging, in regard to physical performance and contribution to reliability assessment.
• Illustrate continuous development and improvement of this material.
6.1.2 Introduction
This chapter briefly reviews the history and use of molding compounds in plastic semiconductor packages, addresses some of the issues and failure modes associated with molding compounds, and touches on future trends.
6.1.3 Background
Molding compounds have been around a very long time, since the advent of the through-hole plastic dual-inline package (DIP) family in the early 1970s. Essentially, molding ...
