x Contents
10.2.6 Neuron Models ....................................................................227
10.2.7 Network Training ................................................................229
10.2.8 Application to 63Sn-37Pb Solder Data ..............................229
Bibliography .................................................................................................230
11. Flip-Chip Assembly for Lead-Free Electronics ....................................235
11.1 Flip-Chip Assembly Process ...........................................................237
11.2 Placement Stage .................................................................................239
11.3 Underll Stage ................................................................................... ...