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Green Electronics Manufacturing
book

Green Electronics Manufacturing

by John X. Wang
July 2012
Intermediate to advanced
360 pages
11h 50m
English
CRC Press
Content preview from Green Electronics Manufacturing
65Fatigue Characterization of Lead-Free Solders
3.3.8 Issues with Lead-Free Solder
The most frequently used lead-free solders are composed of silver (3% to 4%),
copper (0.5% to 0.7%), and tin (the remainder). This family of solders is com-
monly called SAC (Sn–Ag–Cu). The melting point of the respective eutectic
ternary alloy is 217°C (34° higher than the melting point of eutectic tin-lead
alloy).
When compared with standard Sn63Pb37 solder, Pb-free solder has a
higher melting point (217°C versus 183°C) and pushes peak reow tempera-
tures from 220°C to 260°C. This results in a(n)
• Energy consumption increase and impact on the ambiance
• Total ...
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Publisher Resources

ISBN: 9781439826690