
65Fatigue Characterization of Lead-Free Solders
3.3.8 Issues with Lead-Free Solder
The most frequently used lead-free solders are composed of silver (3% to 4%),
copper (0.5% to 0.7%), and tin (the remainder). This family of solders is com-
monly called SAC (Sn–Ag–Cu). The melting point of the respective eutectic
ternary alloy is 217°C (34° higher than the melting point of eutectic tin-lead
alloy).
When compared with standard Sn63Pb37 solder, Pb-free solder has a
higher melting point (217°C versus 183°C) and pushes peak reow tempera-
tures from 220°C to 260°C. This results in a(n)
• Energy consumption increase and impact on the ambiance
• Total ...