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Green Electronics Manufacturing
book

Green Electronics Manufacturing

by John X. Wang
July 2012
Intermediate to advanced
360 pages
11h 50m
English
CRC Press
Content preview from Green Electronics Manufacturing
212 Green Electronics Manufacturing
Syed, A.R. (2004). Accumulated creep strain and energy density based thermal
fatigue life prediction models for SnAgCu solder joints, Proc. 54th ECTC, June
2004, pp. 737–746.
Syed, A.R. (1995). Creep crack growth prediction of solder joints during temperature
cycling: An engineering approach. Trans. of the ASME, 117, 116–122, June.
Teng, C.C., Cheng, Y.K., Rosenbaum, E., and Kang, S.M., iTEM: A temperature-
dependent electromigration reliability diagnosis tool, IEEE Trans. Computer-Aided
Design of Integrated Circuits and Systems, 16(8), 882–893.
Tu, K.N. (2003). Solder Joint Technology: Materials, Properties, and Reliability. Berlin,
Germany: Springer.
Tu, K.N. (2003). Recent advances on electromigration in very-lar ...
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Publisher Resources

ISBN: 9781439826690