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Green Electronics Manufacturing
book

Green Electronics Manufacturing

by John X. Wang
July 2012
Intermediate to advanced
360 pages
11h 50m
English
CRC Press
Content preview from Green Electronics Manufacturing
195Enhancing Reliability of Ball Grid Array
Tunga, K., Pyland, J., Pucha, R.V., and Sitaraman, S.K. (2003). Field-use conditions vs.
thermal cycles: A physics-based mapping study, Proc. 53rd Electronic Components
and Technology Conference, May 27–30, 2003, pp. 182–188.
Wiese, S., Schubert, A., Walter, H., Dudek, R., Feustel, F., Meusel, E., and
Michel, B. (2001). Constitutive behaviour of lead-free solders vs. lead-containing
solders-experiments on bulk specimens and ip-chip joints, Proc. 51st Electronic
Components and Technology Conference, pp. 890–902.
Winter, P.R., and Wallach E.R. (1997). Microstructural modeling and electronic inter-
connect reliability, Int. J. Microcircuits and Electronic Packaging, 20(2), 124–129.
Zahn, B.A. (2002). Finite ...
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Publisher Resources

ISBN: 9781439826690