Green Electronics Manufacturing

240 Green Electronics Manufacturing

less expensive equipment. Fluxing options include dispensing, brushing,

pad stamping, and non-contact jet spray uxing.

The ip-chip components themselves may be handled out of trays. There

are several conguration choices that must be made when considering ip-

chip assembly on a pick-and-place machine. They include optical resolution,

lighting geometry, processing capability, pick-and-place tooling, and substrate

lifter tooling. Because the interconnect medium of a ip chip is a solder bump,

simple die edge techniques are inadequate for locating and placing ip chips.

To avoid the possibility of placing ip ...