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Green Electronics Manufacturing
book

Green Electronics Manufacturing

by John X. Wang
July 2012
Intermediate to advanced
360 pages
11h 50m
English
CRC Press
Content preview from Green Electronics Manufacturing
233Modeling of Elastic-Plastic Behavior of Solder Alloys
Racz, L.M., and Szekely, J. (1993). An analysis of the applicability of wetting balance
measurements of components with dissimilar surfaces, Advances in Electronic
Packaging, ASME, EEP-4-2, 1103–1111.
Shi, X.Q., Pang, H.L.J., Zhou, W., and Wang, Z.P. (1999). A modied energy-based
low cycle fatigue model for eutectic solder alloy, Scripts Material, 41(3), 289–296.
Skrzypek, J.J., and Hetnarski, R.B. (1993). Plasticity and Creep-Theory, Examples, and
Problems, Boca Raton, FL: CRC Press.
Steinberg, D.S. (2000). Vibration Analysis for Electronic Equipment. New York: John
Wiley & Sons.
Strauss, R. (1998). SMT Soldering Handbook, (Second edition). Maryland Heights, MO:
Elsevier/Newnes.
Suo, Z. ...
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Publisher Resources

ISBN: 9781439826690