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Green Electronic Assembly: Strategic
Industry Interconnection Direction
Metallurgical interactions occur between lead-free solders and electrical
pad metals in fabrication process, and these intermetallic compounds
continue to grow during service periods. Due to its brittle nature and
lattice mismatch, the solder cracks tend to be generated near the com-
pounds, and these cracks affect the mechanical integrity of lead-free sol-
der joints. Therefore, it is important to study the effect of intermetallic
compounds development on the mechanical properties of the lead-free
solder joints.
Electronic devices make up a large percentage of the hazardo ...