July 2012
Intermediate to advanced
360 pages
11h 50m
English
Content preview from Green Electronics Manufacturing
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282 Green Electronics Manufacturing
Wu, W., Kang, S.H., Yuan, J.S., and Oates, A.S. (2000). Electromigration performance
for Al/SiO2, Cu/SiO2 and Cu/low-k interconnect systems including Joule heat-
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Yeh, C.-P., Zhou, W.X., and Wyatt, K. (1996). Parametric nite element analysis of ip
chip reliability, Int. J. Microcircuits and Electronic Packaging, 19(2), 120–127.
Zahn, B.A. (2002). Finite element based solder joint fatigue life predictions for a same
die size stacked chip scale ball grid array package, SEMICON West, International
Electronics Manufacturing Technology (IEMT) Symposium, pp.274–284.
Zahn, B.A. (2003). Solder joint fatigue life model methodology ...
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O’Reilly covers everything we've got, with content to help us build a world-class technology community, upgrade the capabilities and competencies of our teams, and improve overall team performance as well as their engagement.Julian F.
I wanted to learn C and C++, but it didn't click for me until I picked up an O'Reilly book. When I went on the O’Reilly platform, I was astonished to find all the books there, plus live events and sandboxes so you could play around with the technology.Addison B.
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I'm always learning. So when I got on to O'Reilly, I was like a kid in a candy store. There are playlists. There are answers. There's on-demand training. It's worth its weight in gold, in terms of what it allows me to do.