July 2012
Intermediate to advanced
360 pages
11h 50m
English
Content preview from Green Electronics Manufacturing
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255Flip-Chip Assembly for Lead-Free Electronics
Lee, S.-W.R. and Lau, J.H. (1998). Solder joint reliability of cavity-down plastic ball
grid array assemblies, Soldering & Surface Mount Technology, 10(1), 26–31.
Manson, S.S. (1965). Fatigue: A complex subject—Some simple approximations,
Experimental Mechanics, 5(7), 193−226.
Nagaraj, B., and Mahalingam, M. (1993). Package-to-board attachment reliability
methodology and case study on OMPAC package, ASME Advances in Electronic
Packaging, EEP-4-1, 537−543.
Pan, T.-Y. (1994). Critical accumulated strain energy (CASE) failure criterion for ther-
mal cycling fatigue of solder joints, ASME Trans., J. Electronic Packaging, 116
(September), 163−170.
Pang, J.H.L., and Chong, D.Y.R. (2001). Flip chip on board ...
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O’Reilly covers everything we've got, with content to help us build a world-class technology community, upgrade the capabilities and competencies of our teams, and improve overall team performance as well as their engagement.Julian F.
I wanted to learn C and C++, but it didn't click for me until I picked up an O'Reilly book. When I went on the O’Reilly platform, I was astonished to find all the books there, plus live events and sandboxes so you could play around with the technology.Addison B.
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I'm always learning. So when I got on to O'Reilly, I was like a kid in a candy store. There are playlists. There are answers. There's on-demand training. It's worth its weight in gold, in terms of what it allows me to do.