Heat Transfer

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Preface

Design and manufacturing of microelectronic devices and systems are multidisci-

plinary engineering activities. With the continuous trend toward miniaturization and

high power density systems, the dependency between different design disciplines has

become even more pronounced. Chip designers, hardware engineers, mechanical

engineers, test engineers, reliability engineers, and thermal engineers can no longer

work in their own solo environments. They are now expected to interact with each

other and ensure that a proposed design from one discipline does not violate the

requirements of other disciplines. Some microelectronic ...