
386 Heat Transfer: Thermal Management of Electronics
be included in the thermal model to obtain more accurate results. The ther-
mal vias can be modeled in detail in component-level thermal simulations,
but appropriate compact models are needed in board-level and system-level
thermal simulations. The simplest compact model for a PCB with thermal via
is a one-dimensional model described in Chapter 5, Section 5.8 and a more
accurate model was described in Chapter 7, Section 7.3.
Many different compact models for transistors and integrated circuits have
been used by thermal engineers. The simplest models represent a component
with a single solid ...