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Heat Transfer
book

Heat Transfer

by Younes Shabany
December 2009
Intermediate to advanced content levelIntermediate to advanced
523 pages
18h 30m
English
CRC Press
Content preview from Heat Transfer
82 Heat Transfer: Thermal Management of Electronics
From Example 5-5,
R
die
°C/W,= 0 013.
R
TIM
°C/W,= 0 032.
R
cap
°C/W= 0 008.
and
R
conv,1
°C/W= 064..
The conduction thermal resistances of the die attach, the
substrate, and the convection thermal resistance on the bottom side of the sub-
strate are
R
L
kA
da
da
m
W/Cm
=
=
×
=
0 0001
20025
008
22
.
.
.
°°C/W
m
W/C
sub
sub
,
.
..
R
L
kA
=
=
×
0 0012
02 00
225
96
11
20 0 025
22
2
2
m
°C/W
W/mC
conv,2
2
=
==
×
.,
.
R
hA
mm
°C/W
2
80= .
Total thermal resistance form the active side of the die to ambient is
11 1
RRRRRR
die-ambientdie TIM cap conv,1 da
=
+++
+
+
RRR
R
subconv,2
die-ambient
+
=
++
11
0 013 0 032 00... 008 064
1
0089680
0 688
+
+
++
=
...
.R
die-ambi
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Publisher Resources

ISBN: 9781439814680