Skip to Main Content
Heat Transfer
book

Heat Transfer

by Younes Shabany
December 2009
Intermediate to advanced content levelIntermediate to advanced
523 pages
18h 30m
English
CRC Press
Content preview from Heat Transfer
162 Heat Transfer: Thermal Management of Electronics
can be made from different materials. The drawbacks of this process are high cost
and unidirectional ow in the heat sink.
Another technology with the ability to produce high aspect ratio heat sinks is
folded n heat sink technology shown in Figure 7.23. A continuous thin sheet of n
material is cut to width and folded to a desired n pitch. Then, the n stock is bonded
to a base with thermal epoxy, brazing, or a soldering process. Folded n heat sinks
can be built with ns as thin as 0.25 mm and aspect ratios as high as 50. Also, n
stock and base can be made from different materials. Folded ...
Become an O’Reilly member and get unlimited access to this title plus top books and audiobooks from O’Reilly and nearly 200 top publishers, thousands of courses curated by job role, 150+ live events each month,
and much more.
Start your free trial

You might also like

Heat Transfer Engineering

Heat Transfer Engineering

C. Balaji, Balaji Srinivasan, Sateesh Gedupudi
Heat and Mass Transfer, 2nd Edition

Heat and Mass Transfer, 2nd Edition

R. Rudramoorthy, K. Mayilswamy
Heat Transfer: Theory and Problems

Heat Transfer: Theory and Problems

R. Rudramoorthy, K. Mayilsamy

Publisher Resources

ISBN: 9781439814680