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Heat Transfer
book

Heat Transfer

by Younes Shabany
December 2009
Intermediate to advanced content levelIntermediate to advanced
523 pages
18h 30m
English
CRC Press
Content preview from Heat Transfer
Thermal Specification of Microelectronic Packages 123
resistance of a package. Figure 6.27 shows that junction-to-air thermal resistance
of a 132-lead PQFP package is less if it is mounted on a board with higher thermal
conductivity. It also shows that the thermal resistance decreases as the PCB area
increases. However, there is no reduction in thermal resistance for PCB to pack-
age area ratios larger than ve. The reason is that the board temperature reduces
at larger distances from the package, the heat ux which is proportional to tem-
perature difference between the board and air reduces, and those areas do not help
in heat dissipation f
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Publisher Resources

ISBN: 9781439814680