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Heat Transfer
book

Heat Transfer

by Younes Shabany
December 2009
Intermediate to advanced content levelIntermediate to advanced
523 pages
18h 30m
English
CRC Press
Content preview from Heat Transfer
Introduction 11
aluminum nitride, having a coefcient of thermal expansion different from
the die. As the magnitude of temperature cycle increases during tempera-
ture and power cycling, tensile stresses are developed in the center portion
of the die and shear stresses are developed at the edge of the die. Ultimate
TABLE 1.1
Coefficients of Thermal Expansion for Typical Packaging Materials
Material
Coefficient of Thermal Expansion
(ppm/°C)
Case Materials
Alumina
Copper
Molding compound
4.3–7.4
16
10–30
Die
Silicon
Germanium
Gallium arsenide
2.3–4.7
5.7–6.1
5.4–5.7
Die attach
Silver lled glass
Polyimide
Silicon-based epoxy
8
40–50
60–80
Lead and lead frame
CDA 194
OLIN 7025 ...
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Publisher Resources

ISBN: 9781439814680