These thermal estimates are minimums and maximums for those types of packages. The
thermal resistance v
alues are highly dependent on the size of the die inside the package,
so refer to the data sheet for the exact maximum value.
The insulating pad also adds to the thermal resistance of the case-to-heatsink.
Choosing the proper insulating pad can minimize this thermal resistance. Two common
technologies are mica and silicone. There are also some ceramic technologies but these
are for highly specialized applications. In addition, some insulators require thermal grease
to attain a good thermal ...
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