March 2015
Intermediate to advanced
732 pages
22h 32m
English
Content preview from The IGBT DeviceBecome an O’Reilly member and get unlimited access to this title plus top books and audiobooks from O’Reilly and nearly 200 top publishers, thousands of courses curated by job role, 150+ live events each month,
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Chapter 6
Package and Module Design
Abstract
The insulated gate bipolar transistor (IGBT) chip must be protected by placing it inside a package. After a discussion of discrete device packaging, various approaches to building multichip IGBT modules are discussed including the flat-pack, press-pack cases. The thermal resistance of various approaches is provided. Smart power modules are described that combine the IGBT chips with their drive and protection circuits. The reliability and failure mechanisms of IGBT modules are discussed including problems created by thermal cycling. Wire bond liftoff and formation of solder voids are the major issues determining reliability.
Keywords
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I'm always learning. So when I got on to O'Reilly, I was like a kid in a candy store. There are playlists. There are answers. There's on-demand training. It's worth its weight in gold, in terms of what it allows me to do.