Hardware Hacking

small footprint and low failure rates.The testing process (done during product manufacturing) is more

expensive than other package types due to the fact that X-rays need to be used to verify that the

solder has properly bonded to each of the ball leads.

With Chip-on-Board (COB) packaging, the silicon die of the IC is mounted directly to the PCB

and protected by epoxy encapsulation (see Figure 2.24).

Proper IC positioning is indicated by a dot or square marking (known as a key) located on one

end of the device (see Figure 2.25). Some devices mark pin 1 with an angled corner (for square

package types such as PLCC). On the circuit board, pin 1 is typically ...