
Figure 2.34 shows the circuit board
before the SMD part removal. Our target
device to remove is the largest device on the
board, the Winbond WTS701EM/T 56-pin
TSOP IC.
The first step is to assemble the syringe,
which contains the no-clean flux. Simply
insert the plunger into the syringe and push
down to dispense the compound (see Figure
2.35).The flux should be applied evenly
across all the pins on the package you will be
removing (see Figure 2.36). Flux is a chemical
compound used to assist in the soldering or
removal of electronic components or other
metals. It has three primary functions:
1. Cleans metals surfaces to assist the
flow of filler metals (solder) ...