Preface to the Second Edition
Eight years have passed since the first edition of this book was published. During this period, considerable research has been produced in the field of three-dimensional (3-D) integration and the first commercial products of multitier DRAM memories have appeared in the market. Furthermore, the introduction of interposers forming 2.5-D systems has enabled the integration of memory and processor modules in close proximity, supporting higher bandwidth for memory-processor communication as compared to individually packaged modules.
The intention of this second edition is to cohesively integrate and present several research milestones from different, yet interdependent, ...
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