Manufacturing Technologies for Three-Dimensional Integrated Circuits
Abstract
The manufacturing processes that enable three-dimensional (3-D) integrated systems, where the interconnections between the noncoplanar circuits are achieved by short vertical vias, are described in this chapter. These interconnect schemes provide the greatest reduction in wirelength and, therefore, the largest improvement in speed and power consumption. Specific fabrication processes that have been successfully developed for 3-D circuits are reviewed. The material in this chapter reviews three alternative approaches for 3-D integration. Monolithic integration that supports transistor level integration, which provides the highest device density, is described ...
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