Thermal Modeling and Analysis
Abstract
Thermal issues are of significant importance in three-dimensional (3-D) circuits. To understand the implications of heat in the performance of 3-D circuits, the different heat transfer mechanisms in integrated circuits are described. To accurately describe the thermal behavior of 3-D circuits, thermal models of different complexity and accuracy and related thermal analysis methods are presented, including models for liquid cooling. These thermal models include both closed-form analytic models and numerical models. Thermal models that utilize the electro-thermal duality for determining the temperature in a 3-D circuit are also discussed. Moreover, thermal models specific to through silicon vias are ...
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