Introduction
Abstract
A historical overview of on-chip interconnect issues is provided in this introductory chapter. The evolution of three-dimensional (3-D) integration as a promising technology to address many of the issues and challenges related to the on-chip interconnect is discussed. Both technical and non-technical issues are considered as 3-D integration requires important changes in traditional business models within the semiconductor industry. The chapter concludes with a description of the organization of the book.
Keywords
Three-dimensional integration; vertical integration; 3-D ICs; on-chip interconnects; emerging technologies
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