
Chapter 1. zSeries 900 overview 5
Figure 1-2 z900 functions and features
1.3.1 Processor
MultiChip Module technology
The MultiChip Module (MCM) for the z900 is an approximately 5-inch-square ceramic
substrate (20 PU models) consisting of 101 layers of glass ceramic and six layers of thin film
wired with 1 km of wire. The PU chip is based on CMOS 8SE with copper interconnect and
Silicon-on-insulator (SOI) technologies on turbo models, or CMOS 8S with copper
interconnect technology on non-turbo models.
20-PU MCM
The 20-PU MCM is the technology cornerstone for the z900, from a 1-way up to a full 16-way
server. Combining up to 32 z900s in a Parallel ...