310CHAPTER 12 Nanocrystalline diamond for RF-MEMS applications
In addition to the copper pads in the actuator frame, copper pads along with tin should
be included in the host substrate for integration. Solid–liquid interdiffusion occurs
between the two phases, resulting in a phase transformation of the liquid component
to a higher melting point material, which is strong enough to serve as a bond and with-
stand elevated temperatures. Copper–tin has been considered a SOLID couple where
tin acts as a melting phase and copper as a solid phase. While integrating, the copper pads
on the actuator are kept on top of the copper–tin stack and heated ...
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