Crystal Growth and Evaluation of Silicon for VLSI and ULSI

382 Crystal Growth and Evaluation of Silicon for VLSI and ULSI

packaging solution. High-performance, high I/O devices such as microprocessors and

peripheral logic use ip-chip mounting, not only for its superior electrical performance

and low parasitics, but also for its ability to enable pad-limited designs that cannot be wire

bonded. Fabrication facilities are being built around the world to produce a number of

different devices on 300mm wafers, including dynamic random access memory (DRAM),

logic, and microprocessors. These high-performance devices will be the rst products to

be bumped on 300 mm wafers. As the technology and availability of 300 mm processing

broadens, more cost-sensitive devices for consumer products will begin to be produ ...