Characterization in Silicon Processing

Minimum contact resistance is obtained by ensuring

that

any unwanted insula-

tor

layer,

such as a thick oxide, is removed from the surface; deposited oxides

will

cause measurement problems if not effectively removed prior to measurement. Na-

tive

oxides

will

be present on most

layers,

but in most cases the standard 100 mg

loading

probe

head

will

effectively puncture this native oxide to make good contact

at the conductive

layer.

This does

rely,

however, on the

probe

head having some

surface roughness or on its being sufficiently sharp. An inversion

layer

common on

/-type silicon substrates

12,13

usually

can be bypassed by using a sharp

probe

wit ...