October 2013
Intermediate to advanced
240 pages
11h 53m
English
Content preview from Characterization in Silicon Processing
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Sheet Resistance and
the
Four Point Probe 23
WALTER
JOHNSON
and
CHUCK
YARLING
Sheet resistance measurements are a way of
electrically
characterizing semiconduc-
tor wafers, thin fdms on wafers, and thin near-surface regions of diffused or ion-
implantation doped wafers. The method of choice for the resistance measurement
is
a four point probe arrangement of contacts with the surface through which
current is passed using two of the probes and the voltage
drop
being measured
across the other two.
Parameter measured
Main
usage
Sample
requirements
Destructive
Accuracy
Quantitative
Lateral
resolution
Depth
resolution
Instrument cost
Size
Electrica ...
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