conditions. It is necessary to establish a relation between processing conditions and
barrier properties to arrive at a barrier with stable properties in VLSI devices. This
is
accomplished by characterizing the film at various stages of processing during
process development. Evaluation of the barrier properties of a film is carried out by
depositing the barrier and the overlayer metal films on unpatterned and patterned
silicon
wafers and heat-treating it to simulate the process conditions, followed by
analytical
examination. A variety of
analytical
tools are used to evaluate the chemi-
cal
composition, microstructure, and chemical stability
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