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Characterization in Silicon Processing
book

Characterization in Silicon Processing

by Yale Strausser
October 2013
Intermediate to advanced
240 pages
11h 53m
English
Newnes
Content preview from Characterization in Silicon Processing
12F
.ι»
1.4
ENERGY(MeV)
Figure
1.10 RBS
spectrum
of a 420
Â-thick graded
Si-,
_
x
Ge
x
film.
Ge
con-
centration varies from
17% to 9%. The
points
are the
count
data,
while
the
solid line
is a
simulated spectrum used
to fit
the data
points.
The
separate peak
to the
right
is the Ge
sig-
nal.
(After Reference
68;
reprinted
by
permission
of M. L.
Green,
AT&T Bell Laboratories.)
controlled-atmosphere loadlock, to minimize the presence of contaminants. High-
quality
Sij
_
x
Ge
x
films have been grown using dichlorosilane and germane at tem-
peratures in the 600—700 °C range.
70
1.6 Si
1
_
x
Ge
x
Material Characterization
Strained
heteroepitaxial films of Sij.^Ge ...
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Publisher Resources

ISBN: 9780080523422