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Characterization in Silicon Processing
book

Characterization in Silicon Processing

by Yale Strausser
October 2013
Intermediate to advanced
240 pages
11h 53m
English
Newnes
Content preview from Characterization in Silicon Processing
Index
.Adhesion
barrier
film
139,140,143
conduction layer 106, 108
effect of oxygen on 56
silicide layer-polysilicon 48, 49
silicide-substrate 88
TiN films 159
tungsten film-substrate 125, 131
AES
See Auger electron spectroscopy.
AFM
See atomic force microscopy,
air
breaks 161
aluminum-based conductors
96—103
aluminum films
98-103
anisotropy
36-37
annealing 62, 65, 88
atomic force microscopy (AFM) 37
Auger
electron spectroscopy (AES)
bond pad surface 119
contact resistance studies 134
depth profile of silicides 83
dopant redistribution 86, 87
incoming
substrate surface 105
oxide properties 84
phosphorus depth 106
polysilicon film glaze 46
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Publisher Resources

ISBN: 9780080523422